Deep level transient spectroscopy study of the damage induced in n-type silicon by a gate oxide etching in a CHF3/Ar plasma

International Journal of vacuum science & technology B 15(3):623 - 628

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Hlavní autoři: Adegboyega, G., Perez, I.V, Poggi, Antonella, Susi, E
Médium: Časopis
Jazyk:angličtina
Vydáno: Journal of vacuum science & technology B 2020
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On-line přístup:https://ir.oauife.edu.ng/handle/123456789/5091
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author Adegboyega, G.
Perez, I.V
Poggi, Antonella
Susi, E
author_facet Adegboyega, G.
Perez, I.V
Poggi, Antonella
Susi, E
author_sort Adegboyega, G.
collection DSpace
description International Journal of vacuum science & technology B 15(3):623 - 628
format Journal
id oai:ir.oauife.edu.ng:123456789-5091
institution My University
language English
publishDate 2020
publisher Journal of vacuum science & technology B
record_format dspace
spelling oai:ir.oauife.edu.ng:123456789-50912020-01-20T12:28:26Z Deep level transient spectroscopy study of the damage induced in n-type silicon by a gate oxide etching in a CHF3/Ar plasma Adegboyega, G. Perez, I.V Poggi, Antonella Susi, E transient spectroscopy the dry etching Arrhenius plot activation energies, International Journal of vacuum science & technology B 15(3):623 - 628 Deep level transient spectroscopy was used to detect the presence of deep levels correlated to the defects induced in the Si substrate by a CHF <sub> 3 </sub> /Ar dry etch of a 550 Å gate oxide as a function of the rf power. Several energy levels were observed; some of them were due to the processing before the dry etching. Three traps produced by the dry etching, with Arrhenius plot activation energies, respectively, E<sub> na1 </sub>=350  meV , E<sub> na2 </sub>=220  meV , and E<sub> na3 </sub>=100  meV , and capture cross sections around 10<sup>-20</sup>  cm <sup> 2 </sup> were detected. The correlation with the surface recombination velocity variations and the F and C diffusion in the Si substrate was investigated. © 1997 American Vacuum Society 2020-01-20T12:28:24Z 2020-01-20T12:28:24Z 1997-06 Journal DOI: 10.1116/1.589304 https://ir.oauife.edu.ng/handle/123456789/5091 en text/plain Journal of vacuum science & technology B
spellingShingle transient spectroscopy
the dry etching
Arrhenius plot activation energies,
Adegboyega, G.
Perez, I.V
Poggi, Antonella
Susi, E
Deep level transient spectroscopy study of the damage induced in n-type silicon by a gate oxide etching in a CHF3/Ar plasma
title Deep level transient spectroscopy study of the damage induced in n-type silicon by a gate oxide etching in a CHF3/Ar plasma
title_full Deep level transient spectroscopy study of the damage induced in n-type silicon by a gate oxide etching in a CHF3/Ar plasma
title_fullStr Deep level transient spectroscopy study of the damage induced in n-type silicon by a gate oxide etching in a CHF3/Ar plasma
title_full_unstemmed Deep level transient spectroscopy study of the damage induced in n-type silicon by a gate oxide etching in a CHF3/Ar plasma
title_short Deep level transient spectroscopy study of the damage induced in n-type silicon by a gate oxide etching in a CHF3/Ar plasma
title_sort deep level transient spectroscopy study of the damage induced in n type silicon by a gate oxide etching in a chf3 ar plasma
topic transient spectroscopy
the dry etching
Arrhenius plot activation energies,
url https://ir.oauife.edu.ng/handle/123456789/5091
work_keys_str_mv AT adegboyegag deepleveltransientspectroscopystudyofthedamageinducedinntypesiliconbyagateoxideetchinginachf3arplasma
AT pereziv deepleveltransientspectroscopystudyofthedamageinducedinntypesiliconbyagateoxideetchinginachf3arplasma
AT poggiantonella deepleveltransientspectroscopystudyofthedamageinducedinntypesiliconbyagateoxideetchinginachf3arplasma
AT susie deepleveltransientspectroscopystudyofthedamageinducedinntypesiliconbyagateoxideetchinginachf3arplasma